Differential scanning calorimetry of the effects of temperature and humidity on phenol-formaldehyde resin cure
- 31 December 1994
- Vol. 35 (26) , 5685-5692
- https://doi.org/10.1016/s0032-3861(05)80042-4
Abstract
No abstract availableKeywords
This publication has 13 references indexed in Scilit:
- Development of dynamic mechanical methods to characterize the cure state of phenolic resole resinsJournal of Applied Polymer Science, 1993
- Phenol-Formaldehyde Resin Curing and Bonding in Steam-Injection Pressing. Part II. Differences Between Rates of Chemical and Mechanical Responses to Resin CureHolzforschung, 1993
- Changes in molecular weight and molecular size with reaction time of a phenol–formaldehyde resolJournal of Applied Polymer Science, 1991
- Differential scanning calorimetry of phenol–formaldehyde resolsJournal of Applied Polymer Science, 1985
- Engineering Plastics from Lignin. IX. Phenolic Resin Synthesis and CharacterizationThe Journal of Adhesion, 1984
- Influence of moisture content on curing behavior of two‐step phenolic molding compoundsPolymer Engineering & Science, 1980
- Curing behavior of two‐step phenolics by solvent extractionJournal of Applied Polymer Science, 1978
- DSC investigations on condensation polymers—I. Analysis of the curing processEuropean Polymer Journal, 1975
- Isothermal transitions of a thermosetting systemJournal of Applied Polymer Science, 1974
- Curing mechanism for phenol—formaldehyde resinsJournal of Polymer Science Part A-1: Polymer Chemistry, 1971