Epoxy multichip modules: A solution to the problem of packaging and interconnection of sensors and signal-processing chips
- 1 March 1993
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 36 (1) , 1-27
- https://doi.org/10.1016/0924-4247(93)80136-5
Abstract
No abstract availableThis publication has 41 references indexed in Scilit:
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