The Auger analysis of contaminants that influence the thermocompression bonding of gold
- 1 August 1977
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 45 (1) , 59-68
- https://doi.org/10.1016/0040-6090(77)90204-8
Abstract
No abstract availableThis publication has 6 references indexed in Scilit:
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- Some Practical Aspects of Electroless Gold PlatingJournal of the Electrochemical Society, 1974
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- Adhesion Mechanism of Gold-Underlayer Film Combinations to Oxide SubstratesJournal of Vacuum Science and Technology, 1969