Fine Pitch Solder Creams

Publisher Website
Google Scholar
Abstract
There is continuous pressure in the electronics industry towards miniaturisation. This has led to the development of fine pitch soldered devices, and this paper considers the concept of solder creams which use a restrictive flux system as suitable for this work, rather than those that employ finer powder. It is shown that the latter type of solder cream must use metal powders with a higher oxide content which will require the cream to contain a more active flux.

This publication has 0 references indexed in Scilit: