Reliability studies of two flip-chip BGA packages using power cycling test
- 1 April 2001
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 41 (4) , 553-562
- https://doi.org/10.1016/s0026-2714(00)00252-3
Abstract
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This publication has 1 reference indexed in Scilit:
- Microelectronics Packaging HandbookPublished by Springer Nature ,1997