Thermomechanical reliability assessment in SM- and COB-technology by combined experimental and finite element method

1 January 1994

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 458-465
https://doi.org/10.1109/relphy.1994.307799

Abstract

In the paper, the authors address the issue of thermo-mechanically stressed microelectronic assemblies. An approach combining finite element simulation and advanced in-situ measuring techniques are presented. Examples given in the text illustrate the application of the experimental methods such as micro moire technique, speckle pattern photography or X-ray stress analysis in connection with numerical simulations. Finally, actual results concerning solder joint reliability are discussed.

Keywords

THERMOMECHANICAL PROCESSES
MICROELECTRONICS
ASSEMBLY
FINITE ELEMENT METHODS
SPECKLE
PHOTOGRAPHY
THERMAL STRESSES
PATTERN ANALYSIS
NUMERICAL SIMULATION
SOLDERING

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