The effects of processing parameters on the microstructure and properties of sputter-deposited TiW thin film diffusion barriers
- 1 October 1987
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 153 (1-3) , 313-328
- https://doi.org/10.1016/0040-6090(87)90192-1
Abstract
No abstract availableKeywords
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- Studies of the Ti-W/Au metallization on aluminumThin Solid Films, 1978
- Diffusion barriers in thin filmsThin Solid Films, 1978
- Intermetallic formation in gold-aluminum systemsSolid-State Electronics, 1970