Suppression of Copper Diffusion Through Barrier Metal-Free Hydrogen Silsesquioxane Dielectrics by NH[sub 3] Plasma Treatment
- 1 January 1999
- journal article
- Published by The Electrochemical Society in Electrochemical and Solid-State Letters
- Vol. 2 (12) , 634
- https://doi.org/10.1149/1.1390931
Abstract
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