Copper Interconnection with Tungsten Cladding for UlSI

Publisher Website

1 January 1991

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 39-40
https://doi.org/10.1109/vlsit.1991.705979

Abstract

No abstract available

Keywords

This publication has 2 references indexed in Scilit:

Projecting interconnect electromigration lifetime for arbitrary current waveforms
IEEE Transactions on Electron Devices, 1990
Interconnection and electromigration scaling theory
IEEE Transactions on Electron Devices, 1987