Fabrication of Through-Wafer Via Conductors in Si by Laser Photochemical Processing
- 1 December 1982
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 5 (4) , 520-521
- https://doi.org/10.1109/tchmt.1982.1135991
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Laser chemical technique for rapid direct writing of surface relief in siliconApplied Physics Letters, 1981
- Laser microphotochemistry for use in solid-state electronicsIEEE Journal of Quantum Electronics, 1980
- Improved performance of GaAs microwave field-effect transistors with low inductance via-connections through the substrateIEEE Transactions on Electron Devices, 1978
- The Fabrication of High Precision Nozzles by the Anisotropic Etching of (100) SiliconJournal of the Electrochemical Society, 1978