Controlled Electromigration for Field Failure Acceleration

• 1 September 1987
• journal article
• Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
• Vol. 10  (3) , 370-373
• https://doi.org/10.1109/tchmt.1987.1134756

Abstract

Keywords

• DEVICE UNDER TEST
• FAILURE ANALYSIS
• ELECTROMIGRATION
• ACCELERATION
• CHEMICALS
• PHYSICAL PROPERTIES
• PRINTED CIRCUIT BOARD
• MOISTURE
• ASSEMBLY
• LIFE EXPECTANCY