Thermal stability of on-chip copper interconnect structures
- 1 June 1995
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 262 (1-2) , 177-186
- https://doi.org/10.1016/0040-6090(95)05841-9
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
- Study of interwell carrier transport by terahertz four-wave mixing in an optical amplifier with tensile and compressively strained quantum wellsApplied Physics Letters, 1994
- Thermal annealing of buried Al barrier layers to passivate the surface of copper filmsApplied Physics Letters, 1994
- Pattern Geometry Effects in the Chemical‐Mechanical Polishing of Inlaid Copper StructuresJournal of the Electrochemical Society, 1994
- Contact and via structures with copper interconnects fabricated using dual Damascene technologyIEEE Electron Device Letters, 1994
- Oxidation resistant high conductivity copper filmsApplied Physics Letters, 1994
- Advanced multilayer metallization schemes with copper as interconnection metalThin Solid Films, 1993
- Chemical Vapor Deposition of Copper for Multilevel MetallizationMRS Bulletin, 1993
- Inlaid Copper Multilevel Interconnections Using Planarization by Chemical-Mechanical PolishingMRS Bulletin, 1993
- Formation of Copper Thin Films by a Low Kinetic Energy Particle ProcessJournal of the Electrochemical Society, 1991
- A high ionization efficiency source for partially ionized beam depositionJournal of Vacuum Science & Technology A, 1988