Damascene copper interconnects with polymer ILDs
- 1 October 1997
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 308-309, 523-528
- https://doi.org/10.1016/s0040-6090(97)00479-3
Abstract
No abstract availableThis publication has 6 references indexed in Scilit:
- Chemical Mechanical Planarization of Microelectronic MaterialsPublished by Wiley ,1997
- Patterning of Benzocyclobutene by Reactive Ion EtchingJournal of the Electrochemical Society, 1996
- Electrochemical Potential Measurements during the Chemical‐Mechanical Polishing of Copper Thin FilmsJournal of the Electrochemical Society, 1995
- Copper interconnection integration and reliabilityThin Solid Films, 1995
- Contact and via structures with copper interconnects fabricated using dual Damascene technologyIEEE Electron Device Letters, 1994
- Process Integration and Manufacturasility Issues for High Performance Multilevel InterconnectMRS Proceedings, 1994