Application of equilibrium thermodynamics to the development of diffusion barriers for copper metallization (invited)
- 31 January 2000
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 50 (1-4) , 357-368
- https://doi.org/10.1016/s0167-9317(99)00303-2
Abstract
No abstract availableKeywords
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