Diffusion Barrier Deposition on a Copper Surface by Atomic Layer Deposition

• 2 July 2002
• journal article
• research article
• Published by Wiley in Chemical Vapor Deposition
• Vol. 8  (4) , 149-153
• https://doi.org/10.1002/1521-3862(20020704)8:4<149::aid-cvde149>3.0.co;2-f

Abstract

Keywords

• ATOMIC LAYER DEPOSITION
• COPPER
• DIFFUSION BARRIER
• TITANIUM NITRIDES
• TUNGSTEN NITRIDES