Guidelines for structural and material-system design of a highly reliable 3D die-stacked module with copper through-vias
- 22 June 2004
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
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- Alternative Z-axis connector technologies for high-density 3-D packagingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
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- A review of 3-D packaging technologyIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1998