A solder joint inspection system for surface mounted pin grid arrays
- 30 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1865-1870 vol.3
- https://doi.org/10.1109/iecon.1993.339358
Abstract
A solder joint visual inspection system for surface mounted pin grid arrays has been developed. An XYZ-robot controls the optical fiber scope (OFS), 0.9 mm in diameter, and obtains an OFS image of the inspected solder joints. A virtual data fuzzy clustering algorithm has also been developed for extracting, from the OFS image, the data regarding joint locations, and the data are then used in defect detection. In an experiment carried out on 7104 solder joints, of which 4 were defective, the system successfully detected all the 4 defects, while the number of "good joints" mistakenly identified as being defective was only 0.8% of the total.Keywords
This publication has 1 reference indexed in Scilit:
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