The Behavior of Polysilicon Thin Film Stress and Structure Under Rapid Thermal Processing Conditions
- 1 January 1988
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
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- Increased oxygen precipitation in CZ silicon wafers covered by polysiliconJournal of Electronic Materials, 1984
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- Structure and Stability of Low Pressure Chemically Vapor‐Deposited Silicon FilmsJournal of the Electrochemical Society, 1978
- Elements of X-Ray DiffractionAmerican Journal of Physics, 1957