Electromigration in integrated circuit conductors
- 20 August 1999
- journal article
- review article
- Published by IOP Publishing in Journal of Physics D: Applied Physics
- Vol. 32 (17) , R109-R118
- https://doi.org/10.1088/0022-3727/32/17/201
Abstract
The important integrated circuit failure mechanism of electromigration is reviewed. The basic physics of failure is introduced and the concepts of electromigration and thermally induced stresses are discussed. A concept of thermodynamics in a conducting material and the response to non-direct current will be presented.Keywords
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