Dielectric analysis of the cure of thermosetting epoxy/amine systems
- 1 March 1989
- journal article
- research article
- Published by Wiley in Polymer Engineering & Science
- Vol. 29 (5) , 325-328
- https://doi.org/10.1002/pen.760290510
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Dielectric analysis of thermoset curePublished by Springer Nature ,1986
- Time–temperature–transformation (TTT) cure diagram: Modeling the cure behavior of thermosetsJournal of Applied Polymer Science, 1983
- The evolution of thermosetting polymers in a conversion–temperature phase diagramJournal of Applied Polymer Science, 1982
- ThermosetsPublished by Elsevier ,1981
- Cross-Linking–Effect on Physical Properties of PolymersJournal of Macromolecular Science, Part C: Polymer Reviews, 1969
- The interpretation of electrical resistivity measurements during epoxy resin cureJournal of Physics D: Applied Physics, 1968
- The Temperature Dependence of Relaxation Mechanisms in Amorphous Polymers and Other Glass-forming LiquidsJournal of the American Chemical Society, 1955
- The Electrical, Chemical and Physical Properties of Alkyd ResinsTransactions of The Electrochemical Society, 1934