Solid‐state characterization of polysilanes containing the sih bond

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Abstract
Organosilicon hydride polymers show promise for high performance photoresist, dielectric, and optical coating applications. In this report we describe the solid‐state characterization of these silicon‐based polymers prepared by reductive condensation and plasma polymerization methods. The combination of high resolution solid‐state NMR, infrared, and Rutherford backscattering spectroscopies provides a quantitative description of the polymer microstructure. As a result of these studies the effects of polymerization conditions on polymer microstructure can be more readily determined and optimized.