Lattice and grain boundary diffusion of copper in thin aluminum films
- 1 August 1977
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 45 (1) , 189-194
- https://doi.org/10.1016/0040-6090(77)90224-3
Abstract
No abstract availableThis publication has 11 references indexed in Scilit:
- Influence of the altered layer on depth profiling measurementsApplied Physics Letters, 1976
- A formalism for extracting diffusion coefficients from concentration profilesSurface Science, 1976
- General formalism for quantitative Auger analysisSurface Science, 1975
- Mass transport during electromigration in aluminum-magnesium thin filmsThin Solid Films, 1975
- Kirkendall study of electromigration in thin filmsThin Solid Films, 1975
- Analysis of grain boundary diffusion in bimetallic thin film structures using Auger electron spectroscopyJournal of Vacuum Science and Technology, 1975
- Quantitative auger analysis of copper-nickel alloy surfaces after argon ion bombardmentSurface Science, 1973
- Impurity Diffusion in AluminumPhysical Review B, 1970
- Analysis of Penetration Data from Grain Boundary Diffusion ExperimentsJournal of Applied Physics, 1969
- CXXXVIII. Concentration contours in grain boundary diffusionJournal of Computers in Education, 1954