A microfabricated floating-element shear stress sensor using wafer-bonding technology
- 1 June 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Journal of Microelectromechanical Systems
- Vol. 1 (2) , 89-94
- https://doi.org/10.1109/84.157363
Abstract
No abstract availableThis publication has 6 references indexed in Scilit:
- Bonding of silicon wafers for silicon-on-insulatorJournal of Applied Physics, 1988
- Design and calibration of a microfabricated floating-element shear-stress sensorIEEE Transactions on Electron Devices, 1988
- Wafer bonding for silicon-on-insulator technologiesApplied Physics Letters, 1986
- An outline of the techniques available for the measurement of skin friction in turbulent boundary layersProgress in Aerospace Sciences, 1979
- Young's Modulus, Shear Modulus, and Poisson's Ratio in Silicon and GermaniumJournal of Applied Physics, 1965
- Piezoresistance Effect in Germanium and SiliconPhysical Review B, 1954