Hot-wall chemical vapor deposition of copper from copper(I) compounds. 2. Selective, low-temperature deposition of copper from copper(I) .beta.-diketonate compounds, (.beta.-diketonate)CuLn, via thermally induced disproportionation reactions
- 1 July 1992
- journal article
- Published by American Chemical Society (ACS) in Chemistry of Materials
- Vol. 4 (4) , 788-795
- https://doi.org/10.1021/cm00022a009
Abstract
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