High Performance Material Technologies for Advanced Circuit Assemblies and MCMs

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Abstract
The growth in the use of MCMs together with other demands for high density interconnect has led to many new material, process and assembly technologies. With the increased availability of ‘known good die’, these requirements are now very important. This paper describes an approach to fabricating high performance circuit modules using novel materials and processes. The technology uses sophisticated print and fire and is compatible with many substrates, including alumina, beryllia, aluminium nitride and glass. The material technology and processes for production of fine line (20 microns) tracking, with compatible dielectric dimensions (25 microns) will be explained and discussed and full performance details given. In addition to the fine geometries achieved, outstanding dielectric performance results (dielectric constant of 3.9, loss factor of 5.10-5) and full details of dielectric performance will be presented and discussed.

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