Ceramic column grid array for flip chip applications

• 19 November 2002
• proceedings article
• Published by Institute of Electrical and Electronics Engineers (IEEE)
• p. 925-929
• https://doi.org/10.1109/ectc.1995.517801

Abstract

Keywords

• STRESS TESTING
• ELECTRONICS PACKAGING
• BALL GRID ARRAY
• FABRICATION
• THERMAL CYCLING
• CERAMICS
• FLIP CHIP
• INTEGRATED CIRCUIT PACKAGING
• RELIABILITY