Abstract
Platinum and platinum alloy films electrodeposited from conventional aqueous electrolytes find application for a wide range of uses. During deposition a variety of problems have to be overcome, necessitating optimisation of process conditions; in addition currently available platinum plating processes are not considered to be particularly efficient. The invention of a new series of aqueous platinum or platinum-alloy electroplating baths which permits thick and adherent deposits to be produced, and which are more efficient than other commercial plating solutions, is now reported. Some results of investigations made on test pieces and limited pre-commercial proving samples, are also given.

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