Photoemission spectroscopy study of aluminum–polyimide interface
- 1 May 1985
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology A
- Vol. 3 (3) , 1390-1393
- https://doi.org/10.1116/1.572786
Abstract
X-ray photoemission spectroscopy has been used to investigate the chemical bonding and reactivity of the Al–polyimide interface. At 300 °C substrate temperature, initial deposition of Al reacts with polyimide up to about 3.5 ml. The reaction occurs mainly with the carbonyl group, resulting in the formation of an intermixed layer. The basic reaction continues with reduced rate up to about 11.5 ml, then unreacted Al appeared on the surface. Further deposition of Al caused formation of unreacted Al islands, as confirmed by cross-sectional TEM observations.Keywords
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