Modelling Thermal Resistance of Power Modules Having Solder Voids With Finite Elements
Open Access
- 1 January 1987
- journal article
- research article
- Published by Hindawi Limited in Active and Passive Electronic Components
- Vol. 12 (4) , 239-250
- https://doi.org/10.1155/1987/19025
Abstract
A general thermal model to calculate the thermal resistance of a power module having rectangular die and layers has been constructed. The model incorporates a finite element computer program to solve for three-dimensional heat conduction. Effects of voids in the solder regions are included. A sample case is analyzed, and a comparison is made to a recent study.Keywords
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