New 3D low loss, wide band microwave interconnection

22 November 2002

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

Vol. 3, 1551-1554 vol.3
https://doi.org/10.1109/mwsym.1997.596638

Abstract

This paper describes a new wide band [0; 40 GHz] vertical interconnection approach between two RF homogeneously grounded coplanar lines. It can be considered as two 90/spl deg/ vertical bends transition. Both electromagnetic simulation and measurement demonstrate very good results on the whole frequency range.

Keywords

WIDEBAND
RADIO FREQUENCY
MAGNETIC MATERIALS
PROBES
TELECOMMUNICATIONS
FREQUENCY MEASUREMENT
ELECTROMAGNETIC MEASUREMENTS
RADAR
COSTS
MICROSTRIP RESONATORS

This publication has 2 references indexed in Scilit:

The Westinghouse high density microwave packaging program
Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
High density microwave packaging for T/R modules
Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002