Low voltage and high speed operating electrostatic wafer chuck

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Abstract
A new electrostatic force expression for the electrostatic wafer chuck with a three layer insulator is introduced. If a few micrometers of air layer is assumed, the expression coincides with the experimental results. An electrostatic wafer chuck with a two layer insulator is designed and evaluated. The bottom layer is a spin coated polyimide and the top layer is a vacuum evaporated alumina. The holding pressure is 35 gf/cm2, when 200 V dc is applied in atmosphere. The pressure is not influenced by the duration of the applied voltage. The residual pressure, after the voltage is turned off, decreases to zero rapidly. The breakdown voltage is from 320 to 700 V. The scratch test shows good results due to a vacuum evaporated alumina layer.

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