Thermal Resistivity at Interfaces between Metal and Dielectric Films at 1.5° to 4.2°K
- 1 February 1966
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 37 (2) , 798-802
- https://doi.org/10.1063/1.1708259
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
- Thermal Resistance at Indium-Sapphire Boundaries between 1.1 and 2.1°KPhysical Review B, 1964
- Effective Thermal Conductance from a Thin Film into Liquid HeliumJournal of Applied Physics, 1964
- Thermal conduction across copper-lead-copper sandwiches at helium temperaturesProceedings of the Physical Society, 1964
- THE TRANSPORT OF HEAT BETWEEN DISSIMILAR SOLIDS AT LOW TEMPERATURESCanadian Journal of Physics, 1959
- Some Experiments on Thermal Contact at Low TemperaturesJournal of Applied Physics, 1956