Use of low cost plastic DIPs and injection molded parts in packaging of optical data links
- 2 January 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 661-666
- https://doi.org/10.1109/ectc.1992.204274
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Physical design and performance of optical data-link packagesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- FDDI - A tutorialIEEE Communications Magazine, 1986
- The FDDI optical data linkIEEE Communications Magazine, 1986