Relation Between Plating Overpotential and Porosity of Thin Nickel Electrolytic Coatings

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Abstract
The relation between plating overpotential and porosity of thin nickel electrolytic coatings (0.2 μm) was investigated. The porosity of nickel coatings was shown to be dependent on coating structure, which is determined by the plating over‐potential. A lower porosity can be achieved by using a relatively high plating overpotential resulting in the deposition of nickel coatings with fine grains. A relation between the through‐coating porosity of thin nickel coatings and the activation overpotential was identified. At plating current densities approaching the limiting current density, the porosity tends to increase due to a mass transport effect on the coating thickness distribution along the substrate surface.

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