Dislocation Mobility in Aluminum

Abstract
Dislocation velocities in aluminum were measured, using the etch‐pit technique of Gilman and Johnston, as a function of stress in the temperature region between liquid‐helium temperature and room temperature. The dislocation‐damping constant B was calculated at various temperatures from the linear portion of the velocity‐vs‐stress curve. The value of B decreases with decreasing temperature in the region from room temperature to 30°K. This result agrees with theoretical predictions of the dislocation damping produced by phonon‐dislocation interactions. Below 30°K the damping constant B increases with decreasing temperature. This latter result disagrees with the accepted theoretical predictions of dislocation damping produced by electron‐dislocation interactions.

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