The role of low temperatures in the operation of logic circuitry

1 January 1970

journal article
Published by Institute of Electrical and Electronics Engineers (IEEE) in Proceedings of the IEEE

Vol. 58 (12) , 1914-1932
https://doi.org/10.1109/PROC.1970.8063

Abstract

It has often been suggested that operating logical circuitry at low temperatures would have many advantages. The purpose of this paper is to evaluate such suggestions quantitatively. Changes in physical properties of materials upon cooling to low temperatures have been analyzed to determine their impact on the parameters which control the performance of logical circuitry. The following topics have been considered: electrical conductivity, thermal conductivity, thermal energy, heat transfer, superconductivity, liquid helium, low-gap high-mobility semiconductors, and thermal activation of atomic motion.

Keywords

LOGIC CIRCUITS
THERMAL CONDUCTIVITY
CONDUCTING MATERIALS
SEMICONDUCTOR MATERIALS
SUPERCONDUCTING MATERIALS
COOLING
PERFORMANCE ANALYSIS
TEMPERATURE CONTROL
RESISTANCE HEATING
HEAT TRANSFER

This publication has 0 references indexed in Scilit: