Ceramic microstructures and properties

Publisher Website
Google Scholar
Abstract
Ceramic materials are currently being used in many applications, and it is expected that there are many new applications of ceramics in high-technology engineering systems, e.g., in microelectronics. However, many problems have to be overcome to improve the properties of the different ceramic components. For an understanding of the properties, a qualitative and quantitative determination of the microstructure is required since many properties are controlled by the microstructure of the materials. The microstructure can be analyzed, e.g., by the different techniques of TEM, which include conventional TEM, high-resolution TEM, and analytical TEM. Those methods allow a detailed description down to the atomic scale of grain boundaries, interphase interfaces, composition, and grain morphologies. Results of microstructural studies on grain boundaries in ceramics and on interfaces of metal/ceramic bonds will be described and correlated to mechanical and electrical properties. The improvement of toughness and strength by various techniques will be discussed.

This publication has 0 references indexed in Scilit: