Metallization for submicron LSI
- 3 October 1986
- Vol. 36 (10) , 689-700
- https://doi.org/10.1016/0042-207x(86)90341-6
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Thermal strain in lead thin films IV: Effects of multiple cycling to 4.2 KThin Solid Films, 1979
- A Review of the Limitations of Aluminum Thin Films on Semiconductor DevicesIEEE Transactions on Parts, Hybrids, and Packaging, 1975