Three-dimensional thermal analysis of high density triple-level interconnection structures in very large scale integrated circuits
- 1 January 1994
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
- Vol. 12 (1) , 59-62
- https://doi.org/10.1116/1.587108
Abstract
No abstract availableThis publication has 0 references indexed in Scilit: