The use environments of electronic assemblies and their impact on surface mount solder attachment reliability
- 1 January 1990
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 13 (4) , 903-908
- https://doi.org/10.1109/33.62538
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Creep-fatigue interactions in soldersPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Surface-mount attachment reliability of clip-leaded ceramic chip carriers on FR-4 circuit boardsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989
- Surface Mount Solder Joint Long‐term Reliability: Design, Testing, PredictionSoldering & Surface Mount Technology, 1989
- Thermal Stress and Low Cycle FatigueJournal of Applied Mechanics, 1966