The Effect of Ageing on the Microstructure of 60:40 Tin‐lead Solders

• 1 January 1991
• journal article
• Published by Emerald Publishing in Soldering & Surface Mount Technology
• Vol. 3  (1) , 20-33
• https://doi.org/10.1108/eb037741

Abstract

Keywords

• MICROSTRUCTURE
• MADE
• AGEING EFFECTS
• SOLDERS
• RAPIDLY
• COARSENED
• MARKEDLY
• LOSS
• SUBSTANTIALLY
• DENDRITES