The quest of porous ELK materials for high performance logic technologies
- 31 December 2006
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 83 (11-12) , 2055-2058
- https://doi.org/10.1016/j.mee.2006.09.007
Abstract
No abstract availableKeywords
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- The Effects of the Mechanical Properties of the Confinement Material on Electromigration in Metallic InterconnectsJournal of Materials Research, 2000