Factors governing aluminium interconnection corrosion in plastic encapsulated microelectronic devices
- 1 January 1977
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 16 (2) , 161-164
- https://doi.org/10.1016/0026-2714(77)90418-8
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Field reliability of plastic encapsulated transistors and integrated circuitsMicroelectronics Reliability, 1971
- Effect of hostile environments on adhesive joints II. Role of water with unstressed epoxide adhesiveBritish Polymer Journal, 1970