PLC-based WDM transceiver with modular structure using chip-scale-packaged OE-devices
- 1 January 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- No. 10928081,p. 662-663
- https://doi.org/10.1109/leos.2005.1548171
Abstract
We propose a novel modular integrated structure to improve the fabrication yield and reliability of planar lightwave circuit (PLC) hybrid-integrated modules. As a key component, we have developed a chip-scale packaging technique for opto-electronic (OE-) devices, and successfully fabricated a 1.3/1.49/1.55-mum optical WDM transceiver moduleKeywords
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