Modular Source-Type 3D Analysis of Scattering Parameters for General Discontinuities, Components and Coupling Effects in (M)MICs
- 1 October 1987
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Research Article: A Comparison of Land Use and Land Cover Data in Watersheds of the Mid-Atlantic Region, USAEnvironmental Practice, 1999
- Hybrid-Mode Analysis of Arbitrarily Shaped Planar Microwave Structures by the Method of LinesIEEE Transactions on Microwave Theory and Techniques, 1984
- The Equivalent Circuit of the Asymmetrical Series Gap in Microstrip and Suspended Substrate LinesIEEE Transactions on Microwave Theory and Techniques, 1982
- Control system design using graphical decomposition techniquesIEE Proceedings D Control Theory and Applications, 1981