Direct chip interconnect using polymer bonding
- 1 March 1990
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 13 (1) , 229-234
- https://doi.org/10.1109/33.52876
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- New Film Carrier Assembly Technology: Transferred Bump TABIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
- A New LSI Interconnection Method for IC CardsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
- Controlled Collapse Reflow Chip JoiningIBM Journal of Research and Development, 1969