Wafer direct bonding: tailoring adhesion between brittle materials

• 10 March 1999
• journal article
• Published by Elsevier in Materials Science and Engineering: R: Reports
• Vol. 25  (1-2) , 1-88
• https://doi.org/10.1016/s0927-796x(98)00017-5

Abstract

Keywords

• WAFER BONDING
• WAFER DIRECT BONDING
• FUSION BONDING
• LOW-TEMPERATURE BONDING
• SMART CUT
• EXFOLIATION
• SILICON-ON-INSULATOR
• ELECTRONIC PROPERTIES