A Two-Dimensional Conjugate Heat Transfer Model for Forced Air Cooling of an Electronic Device

1 March 1989

journal article
Published by ASME International in Journal of Electronic Packaging

Vol. 111 (1) , 41-45
https://doi.org/10.1115/1.3226507

Abstract

Thermal analysis of forced air cooling of an electronic component is modeled as a two-dimensional conjugate heat transfer problem. The velocity field in a constricted channel is first computed. Then, for a typical electronic module, the energy equation is solved with allowance for discontinuities in the thermal conductivity. Variation of the maximum temperature with the average air velocity is presented. The importance of our approach in evaluating possible benefits due to changes in component design and the limitations of the two-dimensional model are discussed.

Keywords

HEAT TRANSFER
COOLING
CHANNELS (HYDRAULIC ENGINEERING)
THERMAL CONDUCTIVITY
CLEARANCES (ENGINEERING)
DESIGN
ELECTRONIC COMPONENTS
EQUATIONS
THERMAL ANALYSIS
TEMPERATURE

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