Prediction of effect of heat sink adhesive on mechanical reliability of a wire bonded plastic ball grid array package
- 25 June 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- PBGA for high power: extending the thermal envelopePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Investigation of heat sink attach methodologies and the effects on package structural integrity and interconnect reliability of the 119-lead plastic ball grid arrayPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Thermal-mechanical strain characterization for printed wiring boardsIBM Journal of Research and Development, 1993