New developments in thermocompression bonding
- 1 August 1966
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 5 (3) , 229-234
- https://doi.org/10.1016/0026-2714(66)90084-9
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- An improved form of thermocompression bondBritish Journal of Applied Physics, 1965
- XLII. The use of plasticine models to simulate the plastic flow of metals.Journal of Computers in Education, 1951